Standard Sputtered Coatings
- Conductive coatings are usually multiple layers applied to ceramics such as Alumina, Aluminum Nitride (AlN), Beryllium Oxide (BeO), and Diamond, as well as Glass, Polymers, PZT, Silicon and other substrates.Conductive layers for circuitry are typically Copper, Gold, Palladium, Platinum or Silver.
- The conductive layers are usually undercoated with an adhesion layer and sometimes a barrier layer to minimize diffusion at higher temperatures.
- Standard adhesion metals are Cr, NiCr, Ti, and TiW.
- Barrier metals include, but are not limited to, Mo, Ni, NiV, Pt, and TiN.
- Thin Films Inc. currently maintains 10 MRC sputtering systems some of which are permanently installed with the following materials to offer 1-3 day delivery as required:
- TiW/Au, TiW/Ni/Au, Cr/Au, Cr/Ni/Au, NiCr/Au, NiCr/Ni/Au, NiCr/Cu, Ti/Au, TiW/NiV/Au, Ti/Pt/Au, Ti/Pd/Au and TiW/Ni/Ag
- Resistor coatings from 10 ohms/square to 200 ohms/square are routinely deposited with either TaN or NiCr. Furnace stabilization from these materials from 350°C to 450°C is utilized to prevent drift at standard operating temperatures. For applications up to 1000 ohms/square SiCr and SiCrOx can be sputtered. Films up to 1 mega-ohm can be deposited utilizing doped poly-Si.
- Dielectric coatings can be deposited by the following methods; RF sputtering, RF reactive sputtering and DC reactive sputtering utilizing a pulsed DC power supply. Methods utilized depend on the application, stress requirements, thickness, density, and index. The most frequent materials deposited are Aluminum Oxide, Silicon Nitride and SiO2. Other dielectric films that can be sputtered include MoO2, PtO2, Ta2O5, TiO2, WO2, Y2O3, and ZrO2.
Transparent Conductive Coatings
- Low resistance/high transmission films of ITO are deposited by a proprietary method on Glass, Silicon and Polymer Substrates. Additional transparent conductive coatings include SnO2, Al doped ZnO2, and thin Ag and Au films protected with a dielectric film.