Dielectric Coatings

• Dielectric coatings can be deposited by the following methods; RF sputtering, RF reactive sputtering and pulsed DC reactive sputtering. Methods utilized depend on the application, stress requirements, thickness, density, and index. The most frequent materials deposited are Aluminum Oxide, Silicon Nitride and SiO2. Other dielectric films that can be sputtered include MoO₂, PtO₂, Ta₂O₅, TiO₂, WO₂, Y₂O₃, and ZrO₂.

Transparent Conductive Coatings

• Low resistance/high transmission films of ITO are deposited by a proprietary method on Glass, Silicon and Polymer Substrates. Additional transparent conductive coatings include SnO₂, Al doped ZnO₂, and thin Ag and Au films protected with a dielectric film.

Hard Coatings

• Hollow Cathode Magnetron Sputtering (with substrate ion bombardment) is used for coating three dimensional parts as they rotate during deposition. The coatings may also be applied to flat (two dimensional) substrates.
• TiN can be reactively sputtered which produces a hard, gold colored coating.
• TiOxNy may be sputtered for a dark colored hard coating.
• TiB₂ coatings can be sputtered on planar substrates that produce ultra hard and smooth coatings approaching approximately the hardness of diamond.

Heat Sinks

Heat sinks can be manufactured to design or coated with AuGe, AuSn, Sn, and In. The In has low roughness and the coatings are very uniform.

Miscellaneous Coatings

We have the following materials in stock, so that we can respond quickly to various customer requirements.Over the past 25+ years we also developed processes to clean and coat customer parts with the materials listed.

Sputtering targets

Ag—Al—Al 1%Si—Al   2%Cu—AlCu4%—Al 0.5%Cu—Al2O3—AlN—AlZnO—AlNTi—Au—BN—C—Cr—CrSi—CrSiOx—Co—Cu—CuPd—CuSn—CuCr—Fe—Ge—ITO—In—Ir—Mo—MoCu—Monel—MoO2—MoSi2—Nb—NbO2—Ni—-NiCr 50/50—NiCr 70/30—NiCr 80/20—NiFe (permalloy)—NiV—Pd—Pt—PtOx—Pyrex—Rh—Ru—Si—SiC—SiO2—Si3N4—Sn—Ta—TaN—Ta2O5—Ti—TIC–TiB2—TiO2—TiSi—TiW—Rh—Ru—V—W—WS2—Y—Y2O3—Zn—Zr—ZnO2—ZrO2—ZrN