Over the last 25 years, PVD (physical vapor deposition) processes have been developed to deposit various conductive coatings particularly by sputtering. Prior to deposition of the sputtered coatings, the substrate may be cleaned by wet processes followed by DI water rinse and vapor dry. Additionally, dry processes such as plasma ashing, high temperature firing, ozone cleaning, and argon or reactive gas sputter etching can also be utilized. Thin film circuit fabrication and thin film component manufacturing are a growing area of our business. Both wet and dry (Ion Milling/RIE) techniques are employed.
With nearly three decades of experience, THINFILMS, Inc. has made itself known as the premier provider of thin films, sputtered coatings, evaporated coatings, and circuit fabrication. Browse below to learn more about the services we offer. If you have an idea about a service, or would like a quote, feel free to contact us and we will provide you with the quick turnaround time we are known for!